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Silicon Wafer Annealing Boat
-Silicon Boat
Silicon Boats, also known as wafer boats, are critical components in semiconductor manufacturing, designed to securely hold and transport silicon wafers during high-temperature processes such as diffusion, oxidation, and chemical vapor deposition (CVD). Constructed from high-purity silicon or silicon carbide (SiC) composites, these boats feature precision-engineered grooves and slots to minimize direct contact with the wafer surface, reducing the risk of scratches and contamination.
  • High-Temperature Stability: Silicon boats withstand extreme temperatures up to 1400°C, making them ideal for applications like annealing and epitaxial growth in horizontal or vertical furnaces.
  • Material Compatibility: High-purity silicon ensures thermal expansion coefficients closely matched to silicon wafers, preventing warping or lattice mismatch during thermal cycling.
  • Customization: Available in sizes from 200mm to 300mm, with options like inclined grooves for increased wafer loading density and anti-slip designs to enhance stability during automation.
  • Low Particle Emission: Advanced cleaning processes ensure sub-ppb levels of metallic impurities, critical for maintaining yield in high-precision logic and memory chip fabrication.
These boats are integral to semiconductor front-end processes, enabling uniform gas distribution in CVD reactors and precise temperature control in diffusion systems. For advanced applications, silicon carbide (SiC)-coated boats offer superior resistance to corrosive gases like silane (SiH₄) and ammonia (NH₃), extending component lifespan in aggressive environments.

Technical Parameters

No.CharacteristicUnitSpec
1Purity%＞9N
2Material/Mono / Poly
3Diameter scalemm0~1300 / Customizable
4Type/Contains/P type/ N type
5ResistivityΩ•cm3<0.02 / 1~4 / 60~90
6Crystal Orientation/(100)、(111)、(110)
7Operating Temperature ℃<1250 ℃
8Surface treatment/Polishing
Wafer Boat,High-Temperature Silicon Boat

Technical Advantages

  1. Cost-Effective High-Temperature Solution：Ideal for oxidation/annealing processes below 1000°C, offering 40% cost savings versus monocrystalline alternatives.

  2. Enhanced Thermal Shock Resistance：Grain boundary structure absorbs thermal stress, reducing crack risks in rapid thermal cycling applications.

  3. Compatibility with Legacy Processes：Proven reliability in 150mm/200mm wafer manufacturing for power devices and analog ICs, with minimal process re-qualification.

  4. Batch Process Scalability：Supports large-volume production with cycle lifetimes exceeding 5,000 runs in non-critical contamination environments.

  5. Customizable Surface Texturing：Engineered contact points minimize wafer imprinting while maintaining alignment stability for 8-inch wafer batches.

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