Provide One-stop Solutions For Si Materials
Technical Parameters
| No. | Characteristic | Unit | Spec |
|---|---|---|---|
| 1 | Purity | % | ＞6N/9N |
| 2 | Material | / | Mono / Poly |
| 3 | Diameter scale | mm | 0~600 / Customizable |
| 4 | Type/Contains | / | P type/ N type |
| 5 | Resistivity | Ω•cm3 | <0.02 / 1~4 / 60~90 |
| 6 | Crystal Orientation | / | (100)、(111)、(110) |
| 7 | Product Length | mm | 1~1000 |
| 8 | Surface treatment | / | Polishing |
Technical Advantages
Superior Thermal & Chemical Stability：CNC-machined silicon parts withstand extreme temperatures (up to 1200°C) and resist corrosion from acids, bases, and plasma environments.
Complex Geometry with Single-Crystal Integrity：Maintain crystal structure integrity during machining, enabling intricate designs for optics, sensors, and wafer processing tools.
Low Contamination & High Purity：ISO Class 7 cleanroom-compatible processes ensure minimal particulate generation, ideal for semiconductor and photonics applications.
Advanced Surface Finishing：Achieve Ra <0.1μm surface roughness for optical-grade silicon components or anti-reflective textured finishes.
Micron-Level Precision: 5-axis CNC machining ensures ±0.001mm accuracy for ultra-precise silicon components in semiconductors and medical devices.
High-Purity Material Expertise: Specialized in semiconductor-grade silicon (99.9999% purity) and advanced materials like SiC/Si₃N₄, processed in contamination-controlled environments.
Complex Geometry Capability: Handles micro-features (50μm+) and large structures (up to 500mm) via CNC milling, EDM, and laser ablation for aerospace/medical designs.