Provide One-stop Solutions For Si Materials
Technical Parameters
| No. | Characteristic | Unit | Spec |
|---|---|---|---|
| 1 | Purity | % | ＞6N/9N |
| 2 | Material | / | Mono / Poly |
| 3 | Diameter scale | mm | 0~600 / Customizable |
| 4 | Type/Contains | / | P type/ N type |
| 5 | Resistivity | Ω•cm3 | <0.02 / 1~4 / 60~90 |
| 6 | Crystal Orientation | / | (100)、(111)、(110) |
| 7 | Product Length | mm | 1~1000 |
| 8 | Surface treatment | / | Polishing |
Technical Advantages
Advanced Laser Drilling Technology：Achieve micron-level precision with minimal thermal damage, ensuring flawless micro-hole patterns for critical applications.
Micron-Level Accuracy for High-Density Arrays：Consistent hole diameters (from 5µm to 50mm) , ideal for MEMS, photonics, and sensor integration.
Superior Material Integrity：High-purity monocrystalline silicon substrates maintain exceptional thermal stability (up to 1200°C) and electrical performance.
Custom Design Flexibility：Tailor hole geometry, pitch, and patterns (hexagonal, radial, or random) to meet your unique R&D or production requirements.
Multi-Layer Compatibility：Seamlessly integrate with thin-film coatings, metallization, and hybrid bonding processes for advanced semiconductor devices.
Rapid Prototyping & Scalable Production：From small-batch R&D samples to high-volume orders, deliver industry-leading turnaround times without compromising quality.
Enabling Next-Gen Innovations：Power breakthroughs in quantum computing, microfluidics, and optical systems with ultra-precise perforated silicon solutions.