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单晶硅管,硅内衬,异形件加工,Monocrystalline silicon tube,Silicon liner,Processing of special-shaped parts
Monocrystalline and polycrystalline silicon profiled tubes are specialized components engineered for high-tech applications requiring exceptional material purity and structural precision. Leveraging ultra-high-purity silicon (99.9999%+), these tubes exhibit superior thermal stability, electrical insulation, and resistance to chemical corrosion. Their unique profiles can be custom-fabricated into complex shapes, such as tapered bends, multi-angle joints, or seamless liners for pipelines of varying diameters. A critical feature is their modular design, enabling precise splicing and alignment to fit intricate pipeline layouts, including tight corners , while maintaining vacuum integrity and minimal contamination risks. Widely used in semiconductor fabrication, photovoltaic systems, and ultra-clean fluid transfer, these silicon tubes ensure reliability in extreme environments.
  • Material Advantages:Monocrystalline Silicon exhibits uniform lattice structure, ideal for semiconductor-grade applications.Polycrystalline Silicon cost-effective with excellent thermal conductivity, widely used in solar energy and industrial pipelines.
  • Customization:Available in diameters from 1 mm to 1000 mm, with tolerance control down to micrometers.Surface treatments (e.g., polished, etched) enhance corrosion resistance and flow efficiency.
  • Interlocking Design:Patented connectors simplify assembly at pipe junctions, reducing installation time by 30%.

Technical Parameters

No.CharacteristicUnitSpec
1Purity%>6N/9N
2Material/Mono / Poly
3Diameter scalemm0~1300 / Customizable
4Type/Contains/P type/ N type
5ResistivityΩ•cm3<0.02 / 1~4 / 60~90
6Crystal Orientation/(100)、(111)、(110)
7Operating Temperature<1250 ℃
8Surface treatment/Polishing
High-purity silicon custom ducting

Technical Advantages

  1. Cost-Effective High-Temperature Solution:Ideal for oxidation/annealing processes below 1000°C, offering 40% cost savings versus monocrystalline alternatives.

  2. Enhanced Thermal Shock Resistance:Grain boundary structure absorbs thermal stress, reducing crack risks in rapid thermal cycling applications.

  3. Compatibility with Legacy Processes:Proven reliability in 150mm/200mm wafer manufacturing for power devices and analog ICs, with minimal process re-qualification.

  4. Batch Process Scalability:Supports large-volume production with cycle lifetimes exceeding 5,000 runs in non-critical contamination environments.

  5. Customizable Surface Texturing:Engineered contact points minimize wafer imprinting while maintaining alignment stability for 8-inch wafer batches.