Provide One-stop Solutions For Si Materials
Technical Parameters
| No. | Characteristic | Unit | Spec |
|---|---|---|---|
| 1 | Purity | % | ＞6N |
| 2 | Material | / | Mono / Poly |
| 3 | Diameter scale | mm | 0~600 / Customizable |
| 4 | Type/Contains | / | P type/ N type |
| 5 | Resistivity | Ω•cm3 | <0.02 / 1~4 / 60~90 |
| 6 | Crystal Orientation | / | (100)、(111)、(110) |
| 7 | Dopant | / | B、P、Ga、As、Sb |
| 8 | Surface treatment | / | Polishing |
Technical Advantages
Ultra-High Purity Silicon Material：Manufactured with 99.9999% purity silicon, ensuring minimal contamination and compatibility with sensitive semiconductor processes.
Establishment of Plasma Etching Condition: silicon ring is designed to establish optimal plasma etching conditions. This ensures precise and efficient etching processes, making silicon rings essential silicon components in advanced semiconductor manufacturing.
Precision Gas Flow Optimization：Advanced geometric design enables uniform gas distribution, reducing etch rate variation to less than ±2% across the wafer.
Use as Electrodes for RF Units: The silicon ring from Jingge can be used as electrodes for RF units. This versatility enhances its functionality in various high-frequency applications, providing reliable performance and stability.
Control Sidewall Damage and Improve Etching Aspect Ratios: silicon ring effectively controls sidewall damage of reactive substances. It improves etching aspect ratios and optimizes etching surfaces, resulting in higher precision and better-quality outcomes in etching processes.
- Improve Uniformity and Yield of Silicon Wafer Edges: The silicon ring from significantly improves the uniformity and yield of silicon wafer edges. This enhancement leads to higher overall efficiency and productivity in semiconductor fabrication.