Provide One-stop Solutions For Si Materials
Technical Parameters
| No. | Characteristic | Unit | Spec |
|---|---|---|---|
| 1 | Purity | % | ＞6N/9N |
| 2 | Material | / | Mono / Poly |
| 3 | Diameter scale | mm | 0~600 / Customizable |
| 4 | Type/Contains | / | P type/ N type |
| 5 | Resistivity | Ω•cm3 | <0.02 / 1~4 / 60~90 |
| 6 | Crystal Orientation | / | (100)、(111)、(110) |
| 7 | Product Length | mm | 1~1000 |
| 8 | Surface treatment | / | Polishing |
Technical Advantages
Ultra-High Purity Material：Crafted from 99.99999%+ purity monocrystalline/polycrystalline silicon, ensuring minimal contamination for semiconductor and photovoltaic applications.
Precision Variable Diameter Machining：Advanced CNC technology enables seamless diameter transitions (0.5-1000mm) with ±0.01mm tolerance, perfect for customized fluid/gas delivery systems.
High-Temperature Resilience：Withstands extreme environments up to 1200°C while maintaining structural integrity, ideal for thermal processing chambers and aerospace components.
Thread Uniformity Assurance：Laser-calibrated threading achieves ISO 228/G standard compliance, guaranteeing leak-proof connections in high-vacuum systems.
Corrosion-Resistant Surface：Passivated silicon surface resists HF acid and plasma erosion, extending service life in chemical etching and semiconductor fabrication.
Customizable Semiconductor-Grade Solutions：Tailored threading patterns and surface finishes (Ra <0.4μm) meet SEMI F57 standards for wafer processing equipment.