Provide One-stop Solutions For Si Materials
Silicon Planar Targets are critical materials for thin film deposition in semiconductor manufacturing, photovoltaic cells, and display technologies. Monocrystalline Silicon Targets offer superior structural uniformity and high-purity performance, with maximum compatibility for large-size substrates up to 450mm in diameter, ideal for advanced semiconductor processes. Polycrystalline Silicon Targets provide flexible solutions through multi-size (multi-segment assembly), enabling cost-effective customization for diverse applications. Both types ensure high sputtering efficiency and stability, meeting the demands of precision thin film coating in industrial and research settings.
Technical Parameters
| No. | Characteristic | Unit | Spec |
|---|---|---|---|
| 1 | Purity | % | ＞6N |
| 2 | Material | / | Mono / Poly |
| 3 | Diameter scale | mm | 0~2000 / Customizable |
| 4 | Type/Contains | / | P type/ N type |
| 5 | Resistivity | Ω•cm3 | <0.02 / 1~4 / 60~90 |
| 6 | Crystal Orientation | / | 、、 |
| 7 | Dopant | / | B、P、Ga、As、Sb |
| 8 | Ra | um | ≤0.8 |
Technical Advantages
Precision Engineering for 450mm Monocrystalline Targets：Achieve ultra-uniform thin-film deposition with our industry-leading 450mm diameter monocrystalline silicon targets, optimized for next-gen semiconductor fabrication.
Flexible Multi-Segment Polycrystalline Solutions：Customize cost-efficient thin-film systems using modular polycrystalline silicon targets, adaptable to diverse sizes and complex coating requirements.
99.9999%+ High-Purity Material Guarantee：Minimize contamination risks with ultra-high-purity silicon targets, ensuring consistent performance in critical applications like MEMS and optoelectronics.
Superior Sputtering Efficiency & Longevity：Maximize productivity through advanced grain structure control, delivering 20% higher target utilization rates versus conventional designs.
End-to-End OEM/Research Compatibility：From R&D labs to mass production, our targets supportfull-process integrationwith PVD, CVD, and ion beam deposition systems.