실리콘 소재를 위한 원스톱 솔루션 제공
기술 사양
| 프로젝트 | 내용 |
|---|---|
| 직경 | 2"(50.8mm), 3"(76.2mm), 4"(100mm), 5"(125mm), 6"(150mm), 8"(200mm), 12"(300mm) |
| 등급 | Prime, Test, Dummy, Reclaimed |
| 성장 방법 | CZ, FZ |
| 오리엔테이션 | 100 , 111 , 110 |
| 유형/도핑제 | P형/붕소, N형/인, N형/비소, N형/안티몬 |
| 저항률 | 0.001에서 10,000 옴·cm까지 |
| 두께 (μm) | 50~3000μm |
| 두께 공차 | 표준 ± 25μm, 최대 정밀도 ± 5μm |
| TTV (μm) | Standard < 10 um、Maximum Capabilities <5 um |
| 보/워프 (μm) | Standard <40 um、Maximum Capabilities <20 um |
| 완료 | 절단, 래핑, 에칭, SSP, DSP 등 |
| 자투리 | 최대 7도 |
| 입자 | <10@0.5um、<10@0.3um、 <10@0.2um |
기술적 장점
Ultra-Precision Surface Control：Atomic-level surface roughness (<0.3nm Ra) with double-side polishing (DSP) technology, enabling defect-sensitive MEMS and nanoscale sensor fabrication.
Flexible Process Adaptability：Compatible with both p-type (Boron-doped) and n-type (Phosphorus/Arsenic-doped) configurations, covering resistivity from 0.001 to 100 Ω·cm for R&D versatility.
Sustainable Cost Efficiency：Reclaimed-grade wafers reduce production costs by 40% while maintaining <15 particles/cm² cleanliness, ideal for non-critical process verification.
Rapid Prototyping Enabler：Thickness tolerance ±10μm and instant-access 100/111 crystal orientations accelerate optoelectronic device development cycles by 30%.
Cross-Industry Compatibility：SEMI-standardized edge profiling ensures seamless integration with 150mm/200mm fab tools for hybrid semiconductor-photovoltaic workflows.
Zero-Contamination Guarantee：Class 10 cleanroom packaging with nitrogen-sealed containers prevents oxidation during storage and shipping.