실리콘 소재를 위한 원스톱 솔루션 제공
기술 사양
| 아니요. | 특징 | 단위 | 사양 |
|---|---|---|---|
| 1 | 순수함 | % | ＞6N/9N |
| 2 | 재료 | / | 모노 / 폴리 |
| 3 | 직경 눈금 | 음 | 0~600 / 사용자 지정 가능 |
| 4 | 유형/포함 사항 | / | P형/ N형 |
| 5 | 저항률 | Ω·cm³ | <0.02 / 1~4 / 60~90 |
| 6 | 결정 방향 | / | (100), (111), (110) |
| 7 | 제품 길이 | 음 | 1~1000 |
| 8 | 표면 처리 | / | 연마 |
기술적 장점
Ultra-Precise 3D Geometry Control：Achieve complex shapes (arcs, micro-cavities, tile patterns) via advanced lithography and anisotropic etching, enabling seamless integration into compact, high-density microdevices.
Stress-Engineered Structural Integrity：Proprietary stress-relief technology minimizes mechanical deformation during shaping, ensuring stability for quantum computing modules and aerospace-grade sensors.
Enhanced Signal Performance in RF & Optical Systems：Curved surfaces reduce signal loss in high-frequency RF circuits and improve light coupling efficiency for optical waveguides and photonic chips.
Customizable Surface Microstructures：Tailor micro-grooves, nano-patterns, or textured edges to optimize functionality in MEMS actuators, lab-on-a-chip devices, and biomedical implants.
High Thermal and Chemical Resistance：Maintain performance under extreme environments (e.g., high-temperature semiconductor processes or corrosive medical diagnostics).