실리콘 소재를 위한 원스톱 솔루션 제공
기술 사양
| 아니요. | 특징 | 단위 | 사양 |
|---|---|---|---|
| 1 | 순수함 | % | ＞6N/9N |
| 2 | 재료 | / | 모노 / 폴리 |
| 3 | 직경 눈금 | 음 | 0~600 / 사용자 지정 가능 |
| 4 | 유형/포함 사항 | / | P형/ N형 |
| 5 | 저항률 | Ω·cm³ | <0.02 / 1~4 / 60~90 |
| 6 | 결정 방향 | / | (100), (111), (110) |
| 7 | 제품 길이 | 음 | 1~1000 |
| 8 | 표면 처리 | / | 연마 |
기술적 장점
Submicron Geometric Accuracy (<±0.2μm) with Multi-axis Diamond Tooling：Achieve complex 3D shapes (prisms, hexagons, waveguides) while preserving crystal lattice integrity.
Semiconductor-Grade Material Compliance (6N+ Purity, ASTM F57)：Guaranteed <0.01ppb metallic impurities for quantum computing and hyperspectral optics applications.
Non-Destructive Edge Profiling via Laser Shock Peening：Create chamfers/radii down to 50μm without microfractures, critical for MEMS membrane durability.
Crystal Orientation-Aligned Machining (XRD Verified)：Precision alignment to <100>, <110>, or <111> planes with 0.5° angular tolerance for epitaxial growth.
CTE-Matched Hybrid Bonding Surfaces：Ultra-flat interfaces (Ra<0.1nm) engineered for direct fusion with Si,or sapphire substrates.
In-situ Metrology-Enabled Adaptive Processing：Real-time Raman spectroscopy feedback adjusts machining parameters to prevent phase transformation.
Vacuum-Compatible Geometric Stability：Maintain dimensional tolerance <5ppm under 10^-9 Torr environments, ideal for space-grade sensors.