실리콘 소재를 위한 원스톱 솔루션 제공
기술 사양
| 아니요. | 특징 | 단위 | 사양 |
|---|---|---|---|
| 1 | 순수함 | % | ＞6N/9N |
| 2 | 재료 | / | 모노 / 폴리 |
| 3 | 직경 눈금 | 음 | 0~600 / 사용자 지정 가능 |
| 4 | 유형/포함 사항 | / | P형/ N형 |
| 5 | 저항률 | Ω·cm³ | <0.02 / 1~4 / 60~90 |
| 6 | 결정 방향 | / | (100), (111), (110) |
| 7 | 제품 길이 | 음 | 1~1000 |
| 8 | 표면 처리 | / | 연마 |
기술적 장점
Advanced Laser Drilling Technology：Achieve micron-level precision with minimal thermal damage, ensuring flawless micro-hole patterns for critical applications.
Micron-Level Accuracy for High-Density Arrays：Consistent hole diameters (from 5µm to 50mm) , ideal for MEMS, photonics, and sensor integration.
Superior Material Integrity：High-purity monocrystalline silicon substrates maintain exceptional thermal stability (up to 1200°C) and electrical performance.
Custom Design Flexibility：Tailor hole geometry, pitch, and patterns (hexagonal, radial, or random) to meet your unique R&D or production requirements.
Multi-Layer Compatibility：Seamlessly integrate with thin-film coatings, metallization, and hybrid bonding processes for advanced semiconductor devices.
Rapid Prototyping & Scalable Production：From small-batch R&D samples to high-volume orders, deliver industry-leading turnaround times without compromising quality.
Enabling Next-Gen Innovations：Power breakthroughs in quantum computing, microfluidics, and optical systems with ultra-precise perforated silicon solutions.